Prime Solutions utilizes several different cleaning processes for the preparation of product prior to the application of inks or compounds. Cleaning processes includes Plasma Cleaning, Flame Treatment or Laser Ablation.
Plasma Cleaning is used for preparing semiconductor products prior to ink marking for better adhesion of inks.
Plasma Cleaning is used to remove and clean contamination from leads, ball arrays and Gold and Nickel surfaces.
Flame treatment is another process utilized by Prime Solutions. It is widely accepted for in line processing of semiconductor packages.
For really tough applications laser treatment of the product surface is possible and in combination with Plasma or Flame treatment this can insure the ultimate bonding of inks or coatings to many substrate materials.
Prime has the right combination of processes to meet the most stringent requirements for adhesion and performance.